honor magic vs arrives with improved hinge lighter body

Honor holds a massive two-day event in China, which culminated today with the announcement of its new foldable flagship – Honor Magic Vs. It is thinner and lighter than its predecessor, and the company revealed the weight reduction comes from an entirely new sophisticated hinge design, allowing the phone to close without a gap.

The Magic Vs comes with a Snapdragon 8+ Gen 1, which might not be the latest from Qualcomm, but is still a pretty capable flagship chipset. The phone has 12/256 GB and 12/512 GB memory options, as well as a new, more affordable variant with 8GB RAM and 256GB…

Link: https://www.gsmdb.com/gsmarena/honor_magic_vs_arrives_with_improved_hinge_lighter_body-news-56628.php